2008年10月15-16日由國際電子工業連接協會IPC和深（shēn）圳市創意時代會（huì）展有限公司共同舉（jǔ）辦的權威技術會議“IPCWorks Asia—無鹵素/無（wú）鉛：綠（lǜ）色製（zhì）造的挑戰”在深圳隆（lóng）重舉辦。大會邀（yāo）請了Dell、華為、確信電子-愛法（Cookson-Alpha）、確信（xìn）電子-樂思化學（Cookson-Enthone）、美國銦公司（Indium）、漢高（Henkel）、泰科納（Ticona）、鬥山電子（Doosan）、德山金屬（Duksan Hi-Metal）、通標（SGS）、斯倍（bèi）利亞（Nihon Superior）等行業技術（shù）專家前來分享無鉛無鹵素製造技術和案例，IPC也（yě）就無鹵素方麵的新標準發表（biǎo）精彩演講。
大會豐富的內容吸引（yǐn）了（le）Sony、Tyco、3M、聯（lián）想、艾默生、富（fù）士康、比亞迪、偉創力、中興、華為、摩派、創維、珠海方正（zhèng）、研祥、台達電子、阿爾卡特、DELPHI、至卓飛高等國內外知名企業近200名技術人員、研發人員及管理人（rén）員出席。本次大（dà）會（huì）是（shì）國內電子製造業針對無鉛無鹵素製（zhì）造技術的年度盛會，在業界推動綠色製造的新技術。
為了規範行業標準（zhǔn），更好地（dì）引導企業實（shí）現綠色製造，IPC經過在行業內（nèi）經過（guò）調研，為一些相關標準做了更新，在本次大會上，IPC的（de）培訓經理楊蕾公布了IPC J-STD-709標準更（gèng）新，內容主要圍繞無鹵素電（diàn）子元件和（hé）組件材料中使用溴和氯最大限度的界定。在調研中，他們得（dé）知，以循環測試來檢驗BS EN14582是一個合適的測試（shì）方法，以確定IPC成員組織普遍使用的材料中氯和溴的全部含量。在今年（nián）在6月4號還訂立了一個合（hé）並1&2級和3&4級的協議。例如一級的物品必須要一些要求，包括其它非（fēi）PCB基材的構（gòu）件，任何均質材料所（suǒ）含的溴（xiù）（如果來源於溴化（huà）阻燃劑）和氯（如果來源（yuán）於氯化阻燃劑和/或聚氯乙（yǐ）烯）必須低於900ppm。除此之外（wài），在非溴化阻燃劑，氯化阻燃劑或聚氯乙烯的均（jun1）質材料中，較高含量的溴和氯（lǜ）是允許（xǔ）的。這個標準的更新將會對元件和電子（zǐ）材料逐漸（jiàn）走向環保型起（qǐ）到促進作用（yòng），得到（dào）業界人士的一致認（rèn）可。
通標標準技術服務有限公司也在關注業界無鹵化發展趨勢（shì），SGS-CSTC高（gāo）級技術主（zhǔ）管韓奕在（zài）演講中解讀了主要（yào）針（zhēn）對鹵係阻燃劑的各無鹵化指標、法律法（fǎ）規和要求，同時闡述了未來無鹵化的技術發展趨勢。同時為電（diàn）子（zǐ）電（diàn）器製造廠“支招（zhāo）”，如（rú）何在節（jiē）省（shěng）環保成本的同時有效（xiào）應對（duì）無鹵化的問題，協助企業為其可持（chí）續性發展奠定堅（jiān）實的基礎。
隨著全（quán）球電子工業對環保的（de）要求越（yuè）來（lái）越高，無鉛製程越來越多地應用到電子工業中。確信電子-樂思化學的亞太區副產品經理李亞全在會上介紹了適用於無鉛裝配的OSP 膜的特（tè）性，並剖析了什麽樣的OSP才能符合無鉛（qiān）焊接製程的要求。
電（diàn）子組裝行業（yè）機構正在製定一些指引，許多消費者和供應商便在印刷電路板、焊接掩（yǎn）膜、模塑化合物、連接器和線纜中使用鹵代化合物，確信電子集中了（le）大量的研（yán）發資源研究出了不含鹵化物和鹵素（sù）的新產（chǎn）品以替代我們的傳統的焊錫產品（pǐn）。確信電子–愛法技術（shù）總監阮金全介紹了電子業界上的無鹵素組裝材料，介紹一些在鹵素測試和開（kāi）發無鹵（lǔ）素助（zhù）焊劑（jì）和焊膏方麵的最新進展。
電子封裝逐漸走向無鹵，無鹵電子封裝材料的研發（fā）和產品化最近變的火熱。漢高（gāo）樂泰(中國)有限（xiàn）公司產品研發高級經理（lǐ）呂道強在題為《無鹵微電子封裝材（cái）料的（de）研發》的演講中，重點（diǎn）講解無鹵焊料，粘膠，和環氧模塑料的研發。美國銦公司魏振喜也著重闡述了無鹵素材（cái）料與測試方法的改進。
鬥山電子先任（rèn）硏究員申周（zhōu）浩介紹了該公（gōng）司的新產品——高多層用High Tg 無鹵素（sù） FR-4，新開發的High Tg，無鹵素FR-4 DS-7402H是代替以往溴係難燃料，適用了反應性引繼難燃劑。新產品受到在場人士的一致認可。
液晶聚合物材料的全球供應商泰科納(Ticona)使（shǐ）用自阻燃的耐高溫材料——液晶聚（jù）合物(LCP)在許多應用（yòng）中取得良好的效果，會議上（shàng）中（zhōng）國區電子電氣行業（yè）市場經理韓文煜與（yǔ）業（yè）內人（rén）士分享了在電子電氣行業的無鹵阻燃方案，可以在電（diàn）子產（chǎn）品在做到無鹵的同時，無需降低產品安全的標準。
DUKSAN HI-METAL德（dé）山金屬（shǔ）對（duì）基於不同焊料合金以及焊（hàn）墊精整的可靠性（xìng）改善（shàn）進行了研（yán）究，得（dé）出銅的含量高，有助於紓緩表麵（miàn）脆（cuì）性的結論。 斯倍利亞貿（mào）易（yì）（上海（hǎi））有限（xiàn）公司營業部經理魏峻在演講中介紹了高可靠性（xìng）的無鉛BGA （SN100C SnCuNi-Ge）錫球。
戴爾公司高級環境顧問壽國輝先（xiān）生介紹了戴爾（ěr）公司（sī）以及相關限用物質法規要求，分（fèn）析並評估了便攜式筆記本電（diàn）腦（nǎo）產品中溴化（huà）阻燃劑（jì）、聚（jù）氯乙烯的使用現狀和無鹵化方案，標明了戴爾公司立誌成為全球最環保科技（jì）公司的承諾的無鹵化立場。華為高級工程師朱愛蘭介紹係統產品無鉛化過程中將麵臨的挑（tiāo）戰，包括材料（liào）應用的挑戰、無鉛工藝（yì）組裝（zhuāng）質量挑戰（zhàn）、可靠性評估方法和產品可靠性的挑戰高可靠性產（chǎn）品無鉛化麵臨的挑戰。
IPCWorks Asia是國（guó）際知名（míng）的技術（shù）研討會活動，每次會議（yì）都會圍繞一個電子製造業熱門的主題展開。IPCWorks Asia 在2007年由IPC和創意時代首次（cì）引入中國，今年是第二次在中國舉辦（bàn），每年10月份在高交會電子（zǐ）展ELEXCON期間舉行（háng）。
October 15-16, 2008 The IPCWorks Asia - Halogen / Lead - free: Green Manufacturing Challenge was held in Shenzhen by the International Federation of Electronics Industry Connecters IPC and Shenzhen Creative Time Exhibition Co., Ltd. The conference invited Dell, Huawei, convinced that Cookson-Alpha, Cookson-Enthone, Indium, Henkel, Ticona, Doosan, Duksan Hi-Metal, SGS, Nihon Superior and other industry experts have come to share lead-free halogen-free manufacturing technology and cases. The new standard in halogen is a wonderful lecture.
The rich content of the conference attracted Sony, Tyco, 3M, Lenovo, Emerson, Foxconn, BYD, Flextronics, ZTE, Huawei, Mosque, Skyworth, Zhuhai Founder, EVOC, Delta Electronics, Alcatel, DELPHI, Well-known enterprises at home and abroad nearly 200 technical staff, research and development personnel and management personnel to attend. The conference is the domestic electronics manufacturing industry for lead-free halogen-free manufacturing technology of the annual event, in the industry to promote green manufacturing of new technologies.
In order to standardize the industry standard, to better guide enterprises to achieve green manufacturing, IPC through the industry through research, for some relevant standards to do the update, in this conference, IPC training manager Yang Lei published IPC J-STD-709 Standard update, the content mainly around the halogen-free electronic components and components in the use of bromine and chlorine materials to maximize the definition. In the survey, they learned that testing the BS EN14582 with a cyclic test was a suitable test method to determine the total content of chlorine and bromine in the materials commonly used by IPC member organizations. In this year on June 4 also entered into a merger 1 & 2 and 3 & 4 level agreement. For example, a class of items must require some requirements, including other non-PCB substrate components, any homogeneous material contained in the bromine (if derived from brominated flame retardants) and chlorine (if derived from chlorinated flame retardants and / Or polyvinyl chloride) must be less than 900 ppm. In addition, higher levels of bromine and chlorine are allowed in non-brominated flame retardants, chlorinated flame retardants or polyvinyl chloride homogeneous materials. This standard update will be on the components and electronic materials gradually play a role in promoting environmental protection, the industry has been unanimously approved.
SGS-CSTC senior technical director Han Yi in the speech interpretation of the main halogen-based flame retardants for the halogen-free indicators, laws and regulations and requirements, and elaborated on the Future Halogenated Technology Development Trends. At the same time for the electrical and electronic factory "Weapon", how to save environmental costs at the same time effective response to halogen-free problems, to help enterprises for its sustainable development and lay a solid foundation.
With the global electronics industry increasingly high demand for environmental protection, lead-free process more and more applied to the electronics industry. The Asia-Pacific By-product Manager, Li Yaquan, who presented the benefits of the lead-free assembly, introduced the characteristics of the OSP film for lead-free assembly and analyzed what OSPs could meet the requirements for lead-free soldering processes.
Electronic assembly industry organizations are developing guidelines for many consumers and suppliers to use halogenated compounds in printed circuit boards, solder masks, molded compounds, connectors and cables, and believe that electronics focus on a large number of R & D resources Halogen-free and halogen-free new products to replace our traditional solder products. Convinced that the electronic - love law technical director Ruan Jinquan introduced the electronics industry halogen-free assembly materials, introduced some in the halogen testing and development of halogen-free flux and solder paste the latest progress.
Electronic packaging gradually to halogen-free, halogen-free electronic packaging materials, research and development and product of the recent changes in the fiery. In the speech entitled "R & D of Halogen-free microelectronic packaging materials", Lu Raoqiang, Senior Manager of R & D of Henkel Loctite (China) Co., Ltd., focused on the development of halogen-free solder, viscose, and epoxy molding compounds. US indium company Wei Zhenxi also highlighted the improvement of halogen-free materials and test methods.
The newly developed High Tg, halogen-free FR-4 DS-7402H is a substitute for the previous bromide-based fuels, which is a new product of high-temperature non-halogen FR-4, Applicable to reactive fuels. New products by the presence of people unanimously approved.
Ticona, a global supplier of liquid crystal polymer materials, has achieved good results in many applications using self-igniting high temperature resistant materials - liquid crystal polymer (LCP). At the conference, China's electronics and electrical industry market manager, Han Wenyu And the industry to share in the electrical and electronic industry, halogen-free flame retardant program, you can do in the electronic products at the same time, without the need to reduce product safety standards.
DUKSAN HI-METAL Dehan metal has studied the improvement of reliability based on different solder alloy and pad finishing, and concluded that copper content is high and helps to relieve surface brittleness. Speaking at the Speech, the manager of the business department of Pennsylvania Trading (Shanghai) Co., Ltd. introduced a highly reliable lead-free BGA (SN100C SnCuNi-Ge) solder ball.
Mr. Shouguo Hui, Senior Environmental Advisor of Dell, introduced Dell's and related restricted substances regulations to analyze and evalsuate the use of brominated flame retardants, polyvinyl chloride and halogen-free solutions in portable notebook products, The company determined to become the world's most environmentally friendly technology company's commitment to halogen-free position. Huawei's senior engineer, Zhu Ailan, describes the challenges that will lead to the lead-free process of the system, including the challenges of material application, the challenges of lead-free process assembly challenges, reliability assessment methods and product reliability challenges. High-reliability products Lead-free challenges The
IPCWorks Asia is an internationally renowned technology seminar, each meeting will focus on a popular topic of electronic manufacturing started. IPCWorks Asia was first introduced to China in 2007 by IPC and the Creative Era, this year is the second time in China, held in October each year at the fair trade show ELEXCON.
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